Yixing Minghao Special Ceramic Technology Co., Ltd.

Yixing Minghao Special Ceramic Technology Co., Ltd.

Manufacturer from China
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Semiconductor Machining Ceramic Parts 95% Al2O3 Wafer Insulating Electronic Ceramic Parts

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Yixing Minghao Special Ceramic Technology Co., Ltd.
Province/State:jiangsu
Country/Region:china
Contact Person:MrLU
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Semiconductor Machining Ceramic Parts 95% Al2O3 Wafer Insulating Electronic Ceramic Parts

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Brand Name :MH
Certification :ISO9001 ROHS
Place of Origin :CHINA
MOQ :100
Price :USD 1-6 PCS
Payment Terms :L/C, T/T, Western Union
Supply Ability :5000 PCS WEEK
Delivery Time :15-20DAYS
Packaging Details :CARTON/WOODEN BOX
Material :99% alumina ceramic
Color :Light yellow
Density :3.9 g/cm³
Certificate :ROHS ISO9001
Hardness :10.7 Gpa
Size :Customers' Requests
Flexural strength :300 Mpa
Thermal conductivity :25 w/(m.k)
Insulation breakdown Intensity :18 KT/mm
OEM,ODM :Accept
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Semiconductor ceramic wafer insulating electronic ceramic parts

Features

✔High mechanical strength and hardness
✔Good electrical insulation
✔Low dielectric constant and dielectric loss
✔Similar thermal expansion with Si
✔High thermal conductivity
✔Excellent corrosion resistance
✔Non-toxic
✔Available for surface metalization

Alumina Ceramic
Alumina ceramic is the most mature of the engineering ceramics, offering excellent electrical insulation properties together with high hardness and good wear resistance,but relatively low strength and fracture toughness.Alumina ceramic is generally white but may also be pink or ivory.The color is derived from either the sintering additives or impurities in the raw materials.

Properties Unit Steatite ceramic 95% Al2O3 99% Al2O3 Zirconia Ceramic
Density g/cm³ 2.8 3.6 3.8 5.6
Flexural strength Mpa 145 300 300 354
Max Working Temperature 1100 1400 1600 1400
Sintering temperature 1350 1700 1750 1550
Heat resistance T(℃) 200 220 200 350
Hardness Gpa 5.7 7 10.7 12.3
Elastic modulus Gpa 120 275 320 205
Poissons ratio - 0.21 0.22 0.22 0.30
Linear expansion coefficient x 10-6/℃ 7.9 7.1 7.8 9
Insulation breakdown Intensity KT/mm 10 16 18 15
Thermal conductivity w/(m.k) 2.5 20 25 2.5
Specific Heat *10-3J/(kg*K) 0.75 0.78 0.78 0.4

Semiconductor Machining Ceramic Parts 95% Al2O3 Wafer Insulating Electronic Ceramic Parts

Semiconductor Machining Ceramic Parts 95% Al2O3 Wafer Insulating Electronic Ceramic Parts

Semiconductor Machining Ceramic Parts 95% Al2O3 Wafer Insulating Electronic Ceramic PartsSemiconductor Machining Ceramic Parts 95% Al2O3 Wafer Insulating Electronic Ceramic Parts

Semiconductor Machining Ceramic Parts 95% Al2O3 Wafer Insulating Electronic Ceramic Parts

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